By Rohit Sharma, Tapas Chakravarty
Compact versions and size strategies for High-Speed Interconnects offers unique research of concerns regarding high-speed interconnects from the viewpoint of modeling techniques and size thoughts. specific concentration is laid at the unified process (variational procedure mixed with the transverse transmission line process) to boost effective compact types for planar interconnects. This ebook will supply a qualitative precis of a number of the mentioned modeling options and ways and should aid researchers and graduate scholars with deeper insights into interconnect types specifically and interconnect usually. Time area and frequency area dimension suggestions and simulation technique also are defined during this book.
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Extra info for Compact Models and Measurement Techniques for High-Speed Interconnects
Again for the proposed models the characteristic impedance closely matches to the simulated values. Readers by now should have a clear idea of computing admittance using the unified approach based on the above two examples. Thus for a range of modified interconnect structures shown in Fig. 3. Parameter extraction time comparison for interconnects given in Fig. 4. 66 GHz CPU with 4 GB memory. The extraction time using the proposed model is greatly reduced. The reduction may be even more for larger and more complex interconnect systems.
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59 mm) 42 3 Compact Models for Novel Interconnects Thus an interconnect line of finite thickness can also be analyzed using the unified model. The set of equations given in Sect. 1 can now be used to compute inductance, impedance and delay constants. The method of computing admittance using the unified approach is efficient yet accurate. Comparison of the analytical results for capacitance and line impedance with 3D field solver and measurements shows good accuracy with less than 5% error. This is shown in Fig.